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(Headquarters: Koriyama, Fukushima Pref.; President: Shigeto Hashimoto). Production will begin in January 2024, and through gradual expansion, the AGC Group’s EUVL mask blank production capacity will expand by approximately 30% of the current capacity in 2025. EUVL mask blanks are used in the EUV lithography process, a manufacturing process for extremely fine semiconductors, and support higher performance semiconductors. Raising semiconductor performance is essential for the advanced information processing required for next-generation high-speed communications and autonomous driving. Demand for EUVL mask blanks is expected to grow significantly in the future as the production of high-performance semiconductors expands. AGC has decided to boost its production capacity to address this increased demand and to produce next-generation products required for further miniaturization of semiconductor manufacturing processes. This production capacity expansion is a project that has been adopted by the Ministry of Economy, Trade and Industry (METI) under its “Program for Promoting Investment in Japan to Strengthen Supply Chains”*1. AGC is the world’s only manufacturer of EUVL mask blanks that can handle every aspect from “glass materials” to “coating”. AGC’s EUVL mask blanks have been adopted by several logic and memory semiconductor manufacturers, thanks to the overall reputation of AGC’s high technology and quality, from glass material technology to film deposition technology. AGC will continue to make aggressive capital investments in the EUVL mask blank business, for which demand is expected to grow significantly, aiming for sales of more than 40 billion yen by 2025 and contributing to the advancement of the semiconductor industry as a materials manufacturer. *1 : This program aims to strengthen supply chain resilience by supporting businesses in building new plants and introducing new facilities for important products and materials in Japan. Reference ■About EUVL mask blanks EUVL mask blanks are a low-thermal expansion glass substrate with various kinds of optical coating films on its surface. An EUV photomask comprises a semiconductor chip circuitry pattern formed onto the surface of an EUVL mask blank, and this circuit is transferred onto a silicon wafer in order to create a semiconductor chip. The requirements for EUVL mask blanks are rising as circuits become ever finer, such as very small defects as close to zero as possible and very high flatness. ■About AGC Electronics Official name AGC Electronics Co., Ltd. Capital 300 million yen Representative Shigeto　Hashimoto Head office location Koriyama, Fukushima Prefecture Employees Approx. 800 Primary business Glass frit and paste, optical pickups and other optoelectronic products, synthetic silica products for semiconductor manufacturing equipment, EUV lithography photomask blanks Media inquiries Chikako Ogawa, General Manager, Corporate Communications & Investor Relations DivisionAGC Inc. Contact: Fujiyama TEL: +81-3-3218-5603 Contact form Share News Index HomeNews AGC to Boost Production Capacity of EUVL Photomask Blanks Check in AGC Site Map About Social Media Contact About This Site Privacy Policy ©AGC Inc.